P6 state clarify and develop and brainstorming(recovery, boot, fastboot, kitchen)



As I promiss, here is the thread for clarify and brainstorming for Ascend P6 avaible development.

First of all, clarify the bootloader and phone status.

Our phone is an "emulator". It is not running Android natively. It's just emulated, Android is running in QEMU. Similar like the real Android SDK.
Huawei patched the QEMU for running Android our MTK chipset.
Huawei take a tricky step. He did the RSA5 encrypt to not able to write any files to the partition system, without a digital signature of Huawei.
Xloader check this signature and if it missing, you won't be able to update. (We are s*cking @ here...)
Bootloader Unlock
It means, you able to send boot image and recovery img via fastboot. I think, our fastboot haven't got some instructions and permission.
If Huawei "unlock the bootloader", 2 way to get this( I think):
1. Modified fastboot, to able flash boot image via fastboot like this:


fastboot flash boot boot.img/recovery.img


flash_image boot boot.img/recovery.img
2. Ignore the whole system signature check. (which is best for we and able to running native Android but it won't be happen)

1 is a big step forward to custom kernel/Custom rom/CM/AOSP.(Of course second is bigger)
I'm just praying first at this moment.


ONE REAL partition are in the MTK NAND chip. Called: hi_mci.1.
The other partitions are NOT REAL! They are emulated. Just like you running LINUX in Virtualbox or something like this.
Those partitions:
/sdcard vfat /dev/block/platform/hi_mci.1/by-name/sdcard
/system ext4 /dev/block/platform/hi_mci.1/by-name/system
/cache ext4 /dev/block/platform/hi_mci.1/by-name/cache
/data ext4 /dev/block/platform/hi_mci.1/by-name/userdata length=-16384
/misc emmc /dev/block/platform/hi_mci.1/by-name/misc
/boot emmc /dev/block/platform/hi_mci.1/by-name/boot
/recovery emmc /dev/block/platform/hi_mci.1/by-name/recovery
/cust ext4 /dev/block/platform/hi_mci.1/by-name/cust
/uboot emmc /dev/block/platform/hi_mci.1/by-name/uboot
/splash2 ext4 /dev/block/platform/hi_mci.1/by-name/splash2
/modem/modem_image ext4 /dev/block/platform/hi_mci.1/by-name/modemimage
/usb vfat /dev/block/sda

For native Android, we need to repartition the hole NAND chip. I think, it is impossible.


Android boot system need boot.img for booting. Which contain the kernel and some system specific files.
This is formatting the device own emulated partition. It contains the ramdisks, etc.

We have an Huaewei Update Extractor, which can be unpack the

We get boot.img, recovery.img. Good.

Our bootloader is UNLOCKED from the begining. I think, our fastboot haven't got some instructions and permission.

With dsiXDA Kitchen you able to unpack boot and recovery.img, modify it and repack.
Just after the B118 update, I hope Huawei unlock this feature. It is a good point to start.

The new driver for ADB/fastboot

To be continued...

And feel free to contribute!

Take a test and build boot.img from b122. Two modification in:
2. ro.debuggable=1

Is this mean, you get true root acces to everywhere.
See in attachment.
Of course, it won't be able to to push via fastboot, because the limitations our fastboot.